EC3645ETTTS-8.000M TR

EC36 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 1MHz to 170MHz Frequency Tolerance/Stability Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration ±100ppm Maximum ±20ppm Maximum ±25ppm Maximum ±50ppm Maximum Operating Temperature Range -10°C to +70°C -40°C to +85°C Supply Voltage 3.3Vdc ±10% Input Current 8mA Maximum over Nominal Frequency of 1MHz to 9.999999MHz 10mA Maximum over Nominal Frequency of 10MHz to 34.999999MHz 25mA Maximum over Nominal Frequency of 35MHz to 49.999999MHz 35mA Maximum over Nominal Frequency of 50MHz to 70MHz 40mA Maximum over Nominal Frequency of 70.000001MHz to 125MHz 50mA Maximum over Nominal Frequency of 125.000001MHz to 170MHz Output Voltage Logic High (VOh) IOH = -4mA 90% of Vdd Minimum IOL = +4mA 10% of Vdd Maximum Output Voltage Logic Low (VOl) Rise/Fall Time Measured at 20% to 80% of waveform 6nSec Maximum over Nominal Frequency of 1MHz to 39.999999MHz 4nSec Maximum over Nominal Frequency of 40MHz to 79.999999MHz 3nSec Maximum over Nominal Frequency of 80MHz to 100MHz 2nSec Maximum over Nominal Frequency of 100.000001MHz to 170MHz Duty Cycle Measured at 50% of waveform 50 ±10(%) 50 ±5(%) Load Drive Capability 15pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State Input Voltage (Vih and Vil) Start Up Time Tri-State (High Impedance) 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output (High Impedance) Disabled Output: High Impedance 10µA Maximum 12kHz to 20MHz offset frequency 1pSec Maximum 10mSec Maximum Storage Temperature Range -55°C to +125°C Standby Current RMS Phase Jitter Revised J: 12/7/2018 Page 2 of 12 www.ecliptek.com EC36 Series PART NUMBERING GUIDE Revised J: 12/7/2018 Page 3 of 12 www.ecliptek.com EC36 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN CONNECTION 1 Tri-State 2 Ground 3 Output 4 Supply Voltage All Tolerances are ±0.1 All Dimensions in Millimeters Revised J: 12/7/2018 Page 4 of 12 www.ecliptek.com EC36 Series OUTPUT WAVEFORM & TIMING DIAGRAM Revised J: 12/7/2018 Page 5 of 12 www.ecliptek.com EC36 Series TEST CIRCUIT FOR CMOS OUTPUT Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass Capacitor close to the package ground and supply voltage pin is required. Note 2: A low input capacitance (10Mohms), and High bandwidth (>300MHz) Passive probe is recommended. Note 3: Capacitance value (CL) includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load Drive Capability’. Revised J: 12/7/2018 Page 6 of 12 www.ecliptek.com EC36 Series TAPE & REEL DIMENSIONS Quantity per Reel: 1000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised J: 12/7/2018 Page 7 of 12 www.ecliptek.com EC36 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) 150°C 175°C 200°C 60 - 180 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 3°C/Second Maximum Peak Temperature (TP) 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 217°C 60 - 150 Seconds High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised J: 12/7/2018 Page 8 of 12 www.ecliptek.com EC36 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) N/A 150°C N/A 60 - 120 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 5°C/Second Maximum Peak Temperature (TP) 240°C Maximum Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 150°C 200 Seconds Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised J: 12/7/2018 Page 9 of 12 www.ecliptek.com